Re: It's Alive!

John,

1) Manual stencil machine. No point for an automated one because this
step takes only 30 seconds.

2) I use top side SMT only. Doing top and bottom triples the process
time (top mount, reflow, glue dispense, bottom mount, reflow again).
Nightmares are made that way; parts falling off in the oven, a "glue
accident" in the machine, etc.

3) The oven is an Essemtec 6 zone IR oven, (preheat, soak and reflow
both top and bottom). About 3 minutes from the goezinta to the
goezouta.

The machime is an FS-730. It was built in '99, has less than 1,000
hrs total time, clean as a whistle and sold for $180K then. Thanks to
the dot.com collapse they can be had for $30K with feeders today.

It boots in WIN95 but runs in DOS. I'm learning its idiosyncrasies
while suppresing mine that applied to dealing with Ursulla.

Mariss



--- In CAD_CAM_EDM_DRO@yahoogroups.com, "jmkasunich
<jmkasunich@y...>" <jmkasunich@y...> wrote:

>
> Cool! I'm curious what your process flow is like. Do you
> use vapor phase, IR, etc, for SMT reflow? what about the
> bottom side (are there SMT parts on the bottom?)
>
> Where I work, the process for most boards is stencil solder
> paste on top, place top side SMT, reflow top side (IR),
> then flip, stencil glue on bottom, place bottom SMT, cure
> glue (also IR), flip again, place thru-hole, then wave
> solder thru-hole and bottom SMT. Some higher density
> boards that are 100% SMT get double sided reflow instead
> of wave.
>
> I find the whole process amazing, and high speed pick
> and place machines are fun to watch. I rarely get to see
> it though, since I work in Cleveland OH and my boards
> are usually built at a plant north of Mukwaukee WI.
>
> John Kasunich