RE: [CAD_CAM_EDM_DRO] Pick and Place question
Posted by
Mark Vaughan
on 2007-03-28 09:08:52 UTC
Hi Brian
For some heavier parts or PCB's subjected to hi G forces and vibrations they
stick block of glue on the PCB where the parts are and glue them down.
Many computer simm memory modules used to be made this way I don't know
whether they still are, but I do remember back in the 90's when I worked in
PA, memory prices went through the roof when the glue factory burnt down. At
that time we were told !! all the memory chips were glued then soldered.
I use a dab of super glue if I want t stick any SMT part, normally before
hand soldering. Hope I won't have to hand solder many again.
There are also times when a group will not have enough component feeders so
they stick the first batch of parts down, and a second machine finishes off
before soldering. I know a group in Essex that did it this way, though now
they have a bigger machine, I have there old one.
Regs Mark
Dr. Mark Vaughan Ph'D. B.Eng. M0VAU
Managing Director
Vaughan Industries Ltd, reg in UK no 2561068
Water Care Technology Ltd, reg in UK no 4129351
Addr Unit3, Sydney House, Blackwater, Truro, Cornwall, TR4 8HH, UK.
Phone/Fax 44 1872 561288
RSGB DRM111(Cornwall)
_____
From: CAD_CAM_EDM_DRO@yahoogroups.com
[mailto:CAD_CAM_EDM_DRO@yahoogroups.com] On Behalf Of BRIAN FOLEY
Sent: 28 March 2007 17:02
To: Cad_CAM_EDM_DRO@yahoogroups.com
Subject: [CAD_CAM_EDM_DRO] Pick and Place question
Hi, i see references to solder paste and then to glue or adhesive. i always
thought the solder paste was used as the adhesive till it was reflowed...
perhaps some one can explain if there is a difference? thanks, brian f.
[Non-text portions of this message have been removed]
[Non-text portions of this message have been removed]
For some heavier parts or PCB's subjected to hi G forces and vibrations they
stick block of glue on the PCB where the parts are and glue them down.
Many computer simm memory modules used to be made this way I don't know
whether they still are, but I do remember back in the 90's when I worked in
PA, memory prices went through the roof when the glue factory burnt down. At
that time we were told !! all the memory chips were glued then soldered.
I use a dab of super glue if I want t stick any SMT part, normally before
hand soldering. Hope I won't have to hand solder many again.
There are also times when a group will not have enough component feeders so
they stick the first batch of parts down, and a second machine finishes off
before soldering. I know a group in Essex that did it this way, though now
they have a bigger machine, I have there old one.
Regs Mark
Dr. Mark Vaughan Ph'D. B.Eng. M0VAU
Managing Director
Vaughan Industries Ltd, reg in UK no 2561068
Water Care Technology Ltd, reg in UK no 4129351
Addr Unit3, Sydney House, Blackwater, Truro, Cornwall, TR4 8HH, UK.
Phone/Fax 44 1872 561288
RSGB DRM111(Cornwall)
_____
From: CAD_CAM_EDM_DRO@yahoogroups.com
[mailto:CAD_CAM_EDM_DRO@yahoogroups.com] On Behalf Of BRIAN FOLEY
Sent: 28 March 2007 17:02
To: Cad_CAM_EDM_DRO@yahoogroups.com
Subject: [CAD_CAM_EDM_DRO] Pick and Place question
Hi, i see references to solder paste and then to glue or adhesive. i always
thought the solder paste was used as the adhesive till it was reflowed...
perhaps some one can explain if there is a difference? thanks, brian f.
[Non-text portions of this message have been removed]
[Non-text portions of this message have been removed]
Discussion Thread
BRIAN FOLEY
2007-03-28 08:01:26 UTC
Pick and Place question
Mark Vaughan
2007-03-28 09:08:52 UTC
RE: [CAD_CAM_EDM_DRO] Pick and Place question
Jon Elson
2007-03-28 09:46:23 UTC
Re: [CAD_CAM_EDM_DRO] Pick and Place question
Mark Vaughan
2007-03-28 11:48:36 UTC
RE: [CAD_CAM_EDM_DRO] Pick and Place question
BRIAN FOLEY
2007-03-28 12:47:14 UTC
Re: [CAD_CAM_EDM_DRO] Pick and Place question
Jon Elson
2007-03-28 23:47:15 UTC
Re: [CAD_CAM_EDM_DRO] Pick and Place question
Jon Elson
2007-03-29 01:55:29 UTC
Re: [CAD_CAM_EDM_DRO] Pick and Place question