Re: [CAD_CAM_EDM_DRO] Pick and Place question

BRIAN FOLEY wrote:

> Hi, i see references to solder paste and then to glue or adhesive. i always thought the solder paste was used as the adhesive till it was reflowed...
> perhaps some one can explain if there is a difference? thanks, brian f.

If you want to place components on BOTH sides of the board and
then reflow the solder all at one time, the bottom-side
components will fall off either before or as it is heating up.
So, you put dots of glue under the bottom-side components before
placing thos parts. You then place the bottom components,flip
over and place the top side. The glue is designed to stick
until the solder melts and pulls the part a bit closer by
surface tension.

The solder paste can be trusted to hold the top-side components
in place if the board isn't handled roughly, but that is about
all. Solder paste is a mix of tiny solder spheres and flux,
with a small amount of solvent to make it flow (barely).

Jon