Re: [CAD_CAM_EDM_DRO] Laser "route" Printed Circuit Boards

But a raster is probably gonna be really, really slow.
I mean, if you're making an 8-mil board, you'd need a much step-over
than 8 mil to raster it, because the rows don't line up perfectly and
the ablation zone can end up as much as 0.9999 the diameter over the
copper at some points. If the wire made an 7-mil ablation circle then
it may be possible, but you might have to do 1 mil stepping to make the
cut line up with the design.

In theory, the software could certainly be made smart enough to step
over exactly where it needed to be, but it's no longer a "raster" per se
and it's hardly simple to make this sort of change.

I still don't see what the idea here is that competes with milling. The
only thing I see is that the Z-depth won't go past the copper, which
isn't that insurmountable of a problem on the PCBs.

Danny

Jon Elson wrote:

> Danny Miller wrote:
>
>> The EDM also needs a guarantee of very good electrical contact on the
>> trace. I'm not sure how that'd be guaranteed as the traces are cut and
>> will become isolated.
>>
> If you do it as a raster, then they never get isolated from the other
> side of the sheet.
>
>> Even if submerged in a conductive liquid, a
>> short, thin trace may not have good current capacity.
>>
>> I just don't see where this has any benefit that compares with milling.
>> The milling machine can route and drill on the same pass as it does with
>> a trace side.
>>
>>
> Yup, it takes a separate machine to do the drilling. But, I gather the
> raster process is
> much faster, just a couple minutes for a small board, no matter how complex.
> But, the added complexity may be why it seems this process may have gone
> off the
> market.
>
> Jon
>
>
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