Re: [CAD_CAM_EDM_DRO] EMC and lathes?

Not only is it not that hard, you will find SMD is actually easier than
leaded components in the long run.

Removing them? You just need a heat gun and some tweezers. 10 sec work
here. Removing a 40 pin DIP will take much longer and carry significant
risk of damaging the pads.

There are many pages giving technique. I do not use the solder wick.
The drag technique works much better. You make sure you've got flux all
over and use a large chisel-tip on the soldering iron, start an
oversized ball of solder on one end and drag it across the line of
pads. It should follow the iron, and will neither bridge pads nor leave
any dry. If you have excess solder at the other end you can pick it up
with the iron itself (wipe off the excess solder on the iron, pick up
the glob on the board), or solder sucker or wick.

Danny

On 12/22/2010 8:50 AM, Jon Elson wrote:
> kabowers@... wrote:
>> The test circuit on the datasheet isn't exactly complete.
> There is also a sheet for the reference design board that has a
> complete, 3-page
> schematic, although it just has buttons for the reset function.
>> Minimal
>> information on the opamp. IIRC the early datasheets on the family
>> omitted current/power dissipation completely.
>> Thanks for the head sup on the reset.I was expecting to have to fiddle
>> with the resistor values. I had noticed the reset was a bit unusual,
>> but had missed the three step part. At lease I haven't etched a board yet.
>> I REALLY wish that family was available in DIP packages. Homebrewing
>> boards for 44-LQFP footprint is a strain and I don't have the equipment
>> to remove them if I goof 8=(
>>
> The small LQFPs aren't that bad, although it GREATLY helps to have a
> stereo zoom
> microscope with a long working distance. I'd be blind by now without that!
> I do chips down to 0.4mm lead pitch, those are a bear. But, you can do
> it with one
> of those jeweler's hoods, solder wick and a small soldering iron. Soon,
> the DIP and other
> large packages will be a thing of the past. Most newer chips are not
> made in DIP, and now
> even standard-size SO is being phased out.
>
> Jon
>
>
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