Re: [CAD_CAM_EDM_DRO] Re: 2 Fried G210's in a single day :-(

mariss92705 wrote:

> >
> > Hmmm, well power electronics is different, of course, but I have
> approximately
> > 0% component failure in the stuff I build. A VERY occasional
> component
> > failure in the field, other than obvious abuse, but almost 100%
> (I'd say,
> > maybe 99.75% if I had to assign a number) of all failures are
> soldering
> > problems or connectors that are not making proper contact.
> >
> Surface mount parts see stresses that thru hole parts don't. They are
> heated to 335 C during soldering and also have mechanical stresses if
> the cool-down cycle is not correct.

Well, I use all SMT semiconductors on my current products, but I hand
solder them. They undoubtedly see less thermal stress than with
a reflow oven. If that is the difference, then their ability to withstand
the rigors of SMT reflow is pretty marginal. One would expect that
taking those parts to higher heat levels needed for lead-free solder
would completely wreck them.

Thanks for the mental tour of your manufacturing process. (Others may
not have gotten much of a picture, but as I read a lot of the trade
press, I know what most of the process looks like.)

Sorry to hear that your pick and place machine is even worse than
I had thought, but I am now limited by how many parts I can stuff and
solder by hand, so I might have to go that route myself at some point.

Jon